IEC 61837-2:2018+AMD1:2020+AMD2:2026 CSV,Surface mounted piezoelectric devices for frequency control and selection – Standard outlines and terminal lead connections – Part 2: Ceramic enclosures.

IEC 61837-2:2018+AMD1:2020+AMD2:2026 is an IEC standard that specifies standardized mechanical outlines and terminal lead connections for surface mounted piezoelectric devices used for frequency control and selection, specifically the version applicable to ceramic enclosures. In practice, it helps manufacturers, PCB designers, and test/assembly teams use consistent package dimensions and lead/terminal configurations so devices can be reliably produced, mounted, and replaced across product generations.

The document is based on IEC 61240:2016 and organizes information around defined ceramic package (enclosure) types, including the drawings and notation needed to describe external dimensions and terminal/leads geometry. It also incorporates amendments: revision of figures to align with updated drawing notation, and the addition of multiple new enclosure types. As a result, the consolidated edition expands the catalog of ceramic enclosure designs (with a total set of enclosure types listed in a table).

In short, IEC 61837-2 is a packaging/interface standard: it standardizes the physical form factor and terminal connection interface of SMD piezoelectric resonators/filters in ceramic packages, enabling consistent mechanical compatibility for frequency-control components.