IEC 61760-1:2026 pdf download,Surface mounting technology – Part 1: Standard method for the specification of surface mounting components (SMDs).
IEC 61760-1:2026 establishes a standardized method for preparing specifications for electronic components intended for surface mounting technology (SMDs). Its main purpose is to ensure that different components can reliably undergo common assembly operations, including placement, soldering, cleaning, inspection, testing, and, where applicable, rework.
The standard defines a reference set of manufacturing process conditions and related test conditions that component manufacturers should consider when developing general, sectional, or detail specifications. It addresses information needed for component classification, physical and dimensional characteristics, marking, terminals and connections, electrical and thermal performance, insulation coordination, mechanical robustness, environmental resistance, and compatibility with assembly processes.
The 2026 edition expands the framework by adding electronic-assembly classification, creepage and clearance requirements, thermal and electrical performance considerations, commonly used solder alloys, low-temperature soldering requirements, resistance to vacuum during soldering, resistance to liquid cleaning media and cleaning processes, and rework-related requirements. It also introduces sustainability-related guidance in a new annex.
The document is intended for component manufacturers, assembly-process designers, purchasers, quality engineers, and users of SMDs. Certain provisions may also apply to leaded components or components using solderless interconnection when they are mounted on circuit boards. By harmonizing specification and testing expectations, the standard improves component interchangeability, process compatibility, production quality, and long-term assembly reliability.